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Norm
ISO 9453:2006
Issue date: 2006 09 22
Soft solder alloys — Chemical compositions and forms
ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
tin-lead, with and without antimony, bismuth, cadmium,...
Withdrawn: 2014 08 18
Publisher:
International Organization for Standardization
Format:
Digital | 10 Pages
Language:
English
Currently valid:
ICS
ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
- tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
- tin-antimony;
- tin-bismuth;
- tin-copper, with and without silver;
- tin-indium, with and without silver and bismuth;
- tin-silver, with and without copper and bismuth;
- tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.
