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Norm
ISO 9453:2020
Issue date: 2020 09 24
Soft solder alloys — Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, in...
Valid
Publisher:
International Organization for Standardization
Format:
Digital | 13 Pages
Language:
English
ICS
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
