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Norm
ISO 9453:1990
Issue date: 1990 11 15
Soft solder alloys — Chemical compositions and forms
Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copp...
Withdrawn: 2006 09 22
Publisher:
International Organization for Standardization
Format:
Digital | 4 Pages
Language:
English
Currently valid:
ICS
Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.