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Norm

ÖNORM EN ISO 9453

Issue date: 2007 01 01

Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)

This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, ...
Withdrawn: 2014 12 15
Publisher:
Austrian Standards International
Format:
Digital | 17 Pages
Language:
German | English | Download GER/ENG
Optionally co-design standards:
This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tin-bismuth; tin-copper, with and without silver; tin-indium, with and without silver and bismuth; tin-silver, with and without copper and bismuth; tin-zinc, with and without bismuth. It also includes an indication of the forms generally available.
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Issue date : 2006 09 22
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