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Norm
ÖNORM EN ISO 9453
Issue date: 2007 01 01
Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)
This International Standard specifies the requirements for chemical composition for the following families of
soft solder alloys:
tin-lead, with and without antimony, ...
Withdrawn: 2014 12 15
Publisher:
Austrian Standards International
Format:
Digital | 17 Pages
Language:
German
| English
| Download GER/ENG
Currently valid:
Optionally co-design standards:
ICS
This International Standard specifies the requirements for chemical composition for the following families of
soft solder alloys:
tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
tin-antimony;
tin-bismuth;
tin-copper, with and without silver;
tin-indium, with and without silver and bismuth;
tin-silver, with and without copper and bismuth;
tin-zinc, with and without bismuth.
It also includes an indication of the forms generally available.
ÖNORM EN ISO 9453
2021 04 01
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
Norm
ÖNORM EN ISO 9453
2014 12 15
Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
Norm
ÖNORM EN ISO 9453
2007 01 01
Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)
Norm
↖
Norm
Issue date :
1992 06 18
Filler metal for soft soldering, brazing and braze welding — Designation
Norm
Issue date :
2014 12 15
Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
