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Norm

ISO 9453:2006

Ausgabedatum: 2006 09 22

Soft solder alloys — Chemical compositions and forms

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium,...
ZURÜCKGEZOGEN: 2014 08 18
Herausgeber:
International Organization for Standardization
Format:
Digital | 10 Seiten
Sprache:
Englisch
Aktuell Gültig:

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

  • tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
  • tin-antimony;
  • tin-bismuth;
  • tin-copper, with and without silver;
  • tin-indium, with and without silver and bismuth;
  • tin-silver, with and without copper and bismuth;
  • tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.

ISO 9453:2020
2020 09 24
Soft solder alloys — Chemical compositions and forms
Norm
ISO 9453:2014
2014 08 18
Soft solder alloys — Chemical compositions and forms
Norm
ISO 9453:2006
2006 09 22
Soft solder alloys — Chemical compositions and forms
Norm
ISO 9453:1990
1990 11 15
Soft solder alloys — Chemical compositions and forms
Norm
Historie aufklappen
Norm
ISO 9453:2014
Ausgabedatum : 2014 08 18
Soft solder alloys — Chemical compositions and forms